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MECHANIC XG50 Solder Paste Sn63Pb37 20-38um 35g BGA Reballing Flux Tin Cream For Mobile Phone Motherboard Chip Soldering Repair
MECHANIC XG50 Solder Paste Sn63Pb37 20-38um 35g BGA Reballing Flux Tin Cream For Mobile Phone Motherboard Chip Soldering Repair
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SPECIFICATIONS
Brand Name: NONE
Certification: CE
Choice: yes
High-concerned chemical: none
Model Number: XG50 / XGSP50
Origin: Mainland China
Particle Size: 20-38μm
Specifications:
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Brand: MECHANIC
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Model: XG50
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Melting Point: 183℃
Precautions:
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Keep away from children.
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Avoid contacting with eyes.
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Use only with adequate ventilation.
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The solder paste contains organic solvent. Avoid repeated contact with skin. If the solder paste gets on your skin, wipe it off with alcohol and rinse thoroughly with water.
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In order to be cautious, in the operation, the smoke released by the solvent during operation should be avoided as much as possible, and the skin and mucous membrane tissues should not be contacted for too long. Avoid repeated breathing of vapor.
Warning:
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The weight mentioned in the picture and description is the gross weight.
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Light shooting and different displays may cause the color of the item in the picture a little different from the real thing.
Package Included:
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1* Mechanic Solder Tin Paste (Model as your choice.)







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